Go top
Paper information

Micro and nano smart composite films based on copper-iodine coordination polymer as thermochromic biocompatible sensors

J. Conesa-Egea, A. Moreno-Vázquez, V. Fernández-Moreira, Y. Ballesteros, M. Castellanos, F. Zamora, P. Amo-Ochoa

Polymers Vol. 11, nº. 6, pp. 1047-1 - 1047-14

Summary:
Herein is presented the preparation and characterization of a composite material obtained by the combination of nanosheets of a coordination polymer (CP) based on the copper(I)-I double chain with response to temperature and pressure with polylactic acid (PLA) as biodegradable organic matrix. The new films of composite materials are generated using a simple and low-cost method and can be created with long lateral dimensions and thicknesses ranging from a few microns to a few nanometers. Studies show that the new material maintains the optical response versus the temperature, while the elasticity and flexibility of the PLA totally quenches the response to pressure previously observed for the CP. This new material can act as a reversible sensor at low temperatures, thanks to the flexibility of the copper(I)-iodine chain that conforms the CP. The addition of CP to the PLA matrix reduces the elastic modulus and ultimate elongation of the organic matrix, although it does not reduce its tensile strength.


Keywords: coordination polymers; smart materials; functional composites; flexible composites; stimuli-responsive materials


JCR Impact Factor and WoS quartile: 3,426 - Q1 (2019); 4,700 - Q1 (2023)

DOI reference: DOI icon https://doi.org/10.3390/polym11061047

Published on paper: June 2019.

Published on-line: June 2019.



Citation:
J. Conesa-Egea, A. Moreno-Vázquez, V. Fernández-Moreira, Y. Ballesteros, M. Castellanos, F. Zamora, P. Amo-Ochoa, Micro and nano smart composite films based on copper-iodine coordination polymer as thermochromic biocompatible sensors. Polymers. Vol. 11, nº. 6, pp. 1047-1 - 1047-14, June 2019. [Online: June 2019]


    Research topics:
  • Nanotechnology
  • Composite materials and adhesive bonding